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rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 2 / 16 ?i unit ?j mm code lette r dimension ( mm ) ?k 1.60 ?} 0.2 ?v 0.80 ?} 0.2 ?? 0.4 ?} 0.1 ?? 0.3 ?} 0.2 ?? 0.3 ?} 0.2 fig.1 construction and dimensions note : ?@ resistive element nichrome alloy thin film ?a elec trode sn - pb plating or tin plating ?b protect ive coat polyimid resin coating ?c substrate alumina ceramic b t ?a ?@ ?b ?c w a a l b
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 3 / 16 4.2 rated dissipation at 70 deg c ?o . ?o?u?r?v [ jis code 1j ] rate d dissipation is based on continuous full load operation at rated ambient temperature of 70 deg c . for resistors operated at ambient temperature in excess of 70 deg c , the maximum load shall be derated in accordance with the following curve. 4.3 rated voltage the d.c. or a.c. r.m.s voltage shall be calculated from the following expression. when the rated voltage exceeds the limiting element voltage, the limiting element voltage shall be the rated voltage. e= ?? r ?~ p where e : rated voltage ?i?u?j r : rated resistance ?i???j p : rated dissipation ?i?v?j 4.4 limiting element voltage 4.5 maximum overload voltage 4. 6 operat ing temperature range 4. 7 storage temperature range 75 ?u 150 ?u -55 to +125 deg c -55 to +125 deg c 5. marking 5.1 marking in e24 series a rated resistance shall be marked on the protect coating with three digit of number. see para.2. ( 3 ) ( example ) 3.9k ??? 39 00 ? ?r?x?q 5.2 marking in e96 series a manufacturing date code or three digit of number shall be marked on the protect coating. ( 1 ) a manufacturing date code refer to jis c 5201 - 1 annex 1 table5 ( 2 ) three digit of number see next table. three digit of number shall be marked on the protect coating. in this case, the three digit of code number shall be added at the end of type designation ?i example ?j 4.99k ???? 499 ?~ 10 ?p marking ?u?w?g type designation ?f rr0816p - 4991 - b - t5 - 68h fig.3 derating curve area of recommended operation percentage of the rated dis sipation ambient temperature -55 70 125 deg c % 100 50 0
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 4 / 16 three digit of resistance code for e96 series code e96series code e96series code e96series code e96series 01 100 * 25 178 49 316 73 562 02 102 26 182 50 324 74 576 03 1 05 27 187 51 332 75 590 04 107 28 191 52 340 76 604 05 110 * 29 196 53 348 77 619 06 113 30 200 * 54 357 78 634 07 115 31 205 55 365 79 649 08 118 32 210 56 374 80 665 09 121 33 215 57 383 81 681 10 124 34 221 58 392 82 698 11 127 35 226 59 402 83 715 12 130 * 36 232 60 412 84 732 13 133 37 237 61 422 85 750 * 14 137 38 243 62 432 86 768 15 140 39 249 63 442 87 787 16 143 40 255 64 453 88 806 17 147 41 261 65 464 89 825 18 150 * 42 267 66 475 90 845 19 154 43 274 67 487 91 866 20 158 44 280 68 499 92 887 21 162 45 287 69 511 93 909 22 165 46 294 70 523 94 931 23 169 47 301 71 536 95 953 24 174 48 309 72 549 96 976 multipliers code code ?` ?g ?b ?c ?d ?e ?q ?r multipliers 10 ?o 10 1 10 2 10 3 10 4 10 5 10 - 1 10 - 2 ?| the resistance value duplicated in e24 series and in e96 series shall be manufactured in e24 series only. 6. performance the test method shall be as spe cified in iec 60115 - 1 . standard atmospheric conditions unless otherwise specified, the standard range of atmospheric conditions for making measurements tests is as follows; temperature 5 to 35 deg c relative humidity 45 to 85%rh air pressure 86 to 106kpa if there is any doubt about results, measurements shall be made within the following limits; temperature 20 ?} 2 deg c relative humidity 60 to 70%rh air pressure 86 to 106kpa
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 5 / 16 6.1 electrical 6.1.1 resistance and tolerance method; refer to iec 60115 - 1, sub - clause 4.5. specification: not exceed the specified tolerance on rated resistance in para.4.1.(2). 6.1.2 temperature characteristic of resistance method; resistance shall be mea sured under standard atmospheric conditions. when the temperature reaches and is maintained at 100 deg c higher than the temperature of standard atmospheric conditions, resistance shall be measured again. the measurement shall be made after a period of 30 min, after each specified temperature is reached. specification: not exceed the specified temperature coefficient of resistance in para.4.1.(3). 6.1.3 overload method; a d.c. or a.c. r.m.s. voltage of 2.5 times the rated voltage shall be applied for 5 se c, and a check shall be made to see if arcing or other damage happened. then the resistor shall be maintained without electrical load for 30 min after which the resistance shall be measured. however the applied voltage shall not exceed the maximum overload voltage. for other procedures, refer to iec 60115 - 1, sub - clause 4.13. specification: change in resistance : ?} (0.5%+0.05 ?? ) without damage by flash over (spark, arcing), burning or breakdown etc. 6.1.4 insulation resistance method; place the specim en on the groove of metal plate so that the edge of metal block positions almost center of both electrodes, with the surface of insulation enclosure located downward or upward and pressurize the block by a force of 1.0 ?} 0.2 n. the test voltage shall be 100 ?} 15 ?u d.c., and maintain this voltage for about 1 min. the insulation resistance shall then be measured while applying the voltage. for other procedures, refer to iec 60115 - 1, sub - clause 4.6 . specification; ( 1 ) between electrodes and insulating enclosure. 100m ?? or more ( 2 ) between electrodes and base material. 1000m ?? or more m e a s u r e m e n t p o i n t b o n m e t a l l i c p l a t e p r e s u r i z a t i o n b y i n s u l a t i n g p l a t e m e a s u r e m e n t p o i n t a o n m e t a l l i c b l o c k b a s e m a t e r i a l i n s u l a t i n g e n c l o s u r e s u r f a c e s p e c i m e n r 0 . 5 ?o s p r i n g
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 6 / 16 6.1.5 voltage proof method; the resistor shall be tested as shown in paragraph 6.1.4. the test voltage shall be a voltage of 100v ( a.c. r.m.s. ) between both electrode. the v oltage is gradually increased at a rate of about 100 v/s. from almost 0 v to the specified voltage and maintained as it is for 60s. +10/0s., then gradually decreased to almost 0 v. for other procedures, refer to iec 60115 - 1, sub - clause 4.7 . specification; change in resistance : ?} ( 0.5%+0.05 ?? ) without damage by flash over ( spark, arcing ) , burning or breakdown etc. 6.2 mechanical 6.2.1 substrate bending test ( bond strength of the face plating ) method; apply pressure in the direction of the arrow at a rate of about 0.5 mm/s. until ben t width reaches 3 mm and hold for 30 s. mounted state test state ?i unit ?f?o?j for other procedures, refer to iec 60115 - 1, sub - clause 4.33 . specification; change in resistance : ?} ( 0.5%+0.05 ?? ) without mechanical damage such as breaks. 4 5 4 5 ?} 2 m m o r l e s s s p e c i m e n t e s t i n g p r i n t e d c i r c u i t b o a r d s u p p o r t ( ? 5 ) s o l d e r r e s i s t a n c e m e t e r b e n d i n g v a l u e 3 m m p r e s s u r i z i n g j i g r 2 3 0 2 0 5 0 l o a d i n g
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 7 / 16 r 0 . 5 s p e c i m e n p r e s s u r i z i n g j i g 1 / 2 ?k ?k 6.2.2 body strength method; a load of 10 n { 1.02kgf } using a r0.5 pressure rod shall be applied to the center in the direction of arrow and held for 10 s. specification ; change in resistance : ?} ( 0.5%+0.05 ?? ) without mechanical damage such as breaks. 6.2.3 resistance to soldering heat method; (1) solder bath method preheat 100 ?` 110deg c 30 s. temperature 270 ?} 5deg c 10 ?} 1 s. (2) reflow soldering method peak temperature 260 ?} 5deg c 10 sec. or less temperature 220deg c over 60 s. max. the heating apparatus shall be the upper - heated oven and the temperature shall be board surface temperature. (3) solderi ng iron method bit temperature 350 ?} 5deg c time 3 +1 ?^ 0 s. the resistor shall be stored at standard atmospheric conditions for 1 hr after which the measurements shall be made. for other procedures, refer to iec 60115 - 1, sub - clause 4.18. specification: change in resistance : ?} (0 .5%+0.05 ?? ) without mechanical damage. electrical characteristics shall be satisfied. 6.2.4 solderability method; temperature of solder 235 ?} 5deg c (solder alloy: sn - 37pb) 245 ?} 5deg c (solder alloy: sn - 3ag - 0.5cu) duration of immer sion 2 ?} 0.5 s. for other procedures, refer to iec 60115 - 1, sub - clause 4.17. specification: a new uniform coating of solder shall cover minimum of 95% of the surface being immersed.
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 8 / 16 6.2.5 solvent resistance method; immersion cleaning at normal temp erature : 300 sec. using isopropyl alcohol. for other procedures, refer to iec 60115 - 1, sub - clause 4.29. specification: marking shall be legible. without mechanical damage and distinct damage in appearance. 6.3 endurance 6.3.1 rapid change of temperat ure method; the resistor shall be subjected to 5 continuous cycles, each as shown in the figure below. ?p minimum operating temperature ?}?r deg c 30 min ?q standard atmospheric conditions 2 ?` 3 min ?r maximum operating temperature ?}?q de g c 30 min ?s standard atmospheric conditions 2 ?` 3 min for other procedures, refer to iec 60115 - 1, sub - clause 4.19. specification; change in resistance : ?} ( 0.5%+0.05 ?? ) without mechanical damage such as breaks and distinct dam age in appearance. marking shall be legible. 6.3.2 endurance ( damp heat with load ) method; the specimen shall be placed in the test chamber at a temperature 40 ?} 2 deg c and a relative humidity 90 to 95 %, and then subjected to a voltage cycle consisting of rated d.c. voltage application of 1 hr 30 min and rest of 30 min repeatedly for 1000 +48/0 hrs. however the applied voltage shall not exceed the limited element voltage. for other procedures, refer to iec 60115 - 1, sub - clause 4.24. specification; change in resistance : ?} ( 0.5%+0.05 ?? ) without mechanical damage such as breaks and distinct damage in appearance. marking shall be legible.
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 9 / 16 6.3.3 endurance ( rated load ) method; the specimen shall be placed in the test chamber at 70 ?} 2 deg c , and then subjected to a voltage cycle consisting of rated d.c. voltage application of 1 hr 30 min and rest of 30 min repeatedly for 1000 +48/0 hrs. however the applied voltage shall not exceed the limited element voltage. for oth er procedures, refer to iec 60115 - 1, sub - clause 4.25. specification; change in resistance : ?} ( 0.5%+0.05 ?? ) without mechanical damage such as breaks and distinct damage in appearance. marking shall be legible.

rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 11 / 16 test board test board a ( for substrate banding, adhesion test, see fig.4 ) material: glass fabric base epoxy resin 1.6mm copper foil, thickness 0.035 mm solder resist coating test board b ( for another test, see fig.5 ) material: glass fabric base epoxy resin 1.6mm copper foil, thickness 0.03 5 mm solder resist coating mounting method ( 1 ) mounting method according to solder bath method epoxy based adhesive agent shall be applied in the middle between the lands of the test board and the resistor shall be mounted in such a way that resistor's electrodes will be evenly placed in the l and area and then the adhesive agent shall be hardened. then a methanol medium of 25% colophony by specific weight is used as flux ( if non-deviant test results are assurable over the counter colophony based flux may be used ) and is soldered by dipping in a molten solder bath of 260 ?} 5 deg c and immersed for 3 to 5 s. ( 2 ) mounting method according to reflow soldering method about 2 00 ? m of solder cream is applied in the land portion of the test boards and the resistor shall be mounted in such a way so that the resistor's electrodes will be evenly placed on the land. it is soldered under the conditions of board surface temperature 240 t o 250deg c ( peak temperature ) for 5 to 10 s. in an upper-portion heated oven.
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 12 / 16 7. packaging resistors shall be in taping. 7.1 dimensions 7.1.1 tape packaging dimensions see fig.6. 7.1.2 reel dimensions see fig.7 or fig.8 7.2 materials tape ?f paper reel ?f plastic 7.3 specification of taping refer to clause 7.1 and iec 60286 - 3. 7.4 pieces per reel 1000 pieces per reel or 5000 pieces per reel . when a quantity is 5000 pieces per reel, code ? - t5 ? shall be added at the end of type designation. see para.2 . 7.5 marking the label indicated following items shall be marked on single side of the reel. ?@ type designation ?a quantity ?b manufacturing date code ( month and year are marked. refer to jis c 5201 - 1 a nnex 1 table5. ?c manufacturer's name ?d country of origin ?e shipping inspection code ?f identification showing lead - free products. example of the label ?q?q?o?w?p?u?o?|?p?o?q?|?a q.t.y 1 000pcs inspected ?? made in japan susumu co.,ltd. n 012501 -- n: (bar code) c: q: (bar code) (bar code) ------------------------------------------------------------------- ------------------------------------------------------------------- ?@ ?a ?b ?d ?e ?c ?f
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 13 / 16 sprocket - hole ? 1.5 + 0.1 rectangular - hole 0.65 ?} 0.1 a b 1.75 ?} 0.1 0.60 ?} 0.05 0 8.0 ?} 0.3 3.5 2.0 ?} 0.05 4.0 ?} 0.1 4.0 ?} 0.1 ?} 0.05 fig.6 dimensions of taping ?| pre-emptied holes : 75 holes ( or 30 cm ) or more. code letter dimension ( mm ) ?? 1.1 ?} 0.1 unit : mm ?? 1.9 ?} 0.1 where : plastic sheet thickness shall be 0.5mm. fig.7. dimensions of reel l a b e l 5 0 9 ?} 0 . 3 1 3 ?} 1 . 4 ? 6 0 0 + 1 1 0 5 ? 1 8 0 0 - 3 r 1 ? 2 1 ?} 0 . 8 2 ?} 0 . 5 ? 1 3 ?} 0 . 2
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 14 / 16 fig.8
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 15 / 16 8. precautions in use 8.1 storage (1) resistor shall be stored in a room where temperature and humidity must be controlled. ( temperature 5 to 35 deg c, humidity 45 to 85 % rh ) however, humidity keep it low, as it is possible. (2) resistor shall be stored as direct sunshine doesn't hit on it. (3) resistor shall be stored with no moisture, dust, a material that will make solderbility inferior, and a harmful gas (hydrogen chloride, sulfurous acid gas, and hydrogen sulfide) . (4) resistor shall be stored with keep ing the minimum package unit with uncivilized sealed (keep the state of the taping). 8.2 time limit to storage (1) the storage time limit of the product is reckoned on the day when the product was shipped by our company and made within one year. (2) confirm solder bility beforehand when you use the one that the time limit was passed. 8.3 chip mounting (1) when chip are mounted on the pc board, the protection coat of resistors must not be scratched. if it will be scratched, it wil l make performance for moisture inferior. (2) in case that resistor will be soldered by soldering iron, heating shall be done on the land, and soldering iron must not hit on the resistor itself. (3) in case that resin coating or resin seal will be made for a pc bo ard after chip mounting, do washing and drying it enough before coating or sealing. if ion bear or moisture will be sealed in resin coating, it will make performance for moisture inferior sometimes. for resinous use, it is necessary to set up enough the c uring conditions. as it get improper for the condition, change of a resistance value are large and are a case. (4) according to shape, material, and pressure of clamping in chip mounting machine, there is the case that crack will be appeared on resistor. contr ol a shock energy for clamping resistor under 7 ?~ 10 ?|?s j. with a shock energy around clamping that says here, it is suited to a potential energy, in case that iron block of 25g is dropped naturally to the resistor placed on iron plate for the height of 2.8mm. (5) the glue to fix a resistor on the pc board aroun d chip mounting, it is needed high insulation resistance and great performance or moisture. and it is needed that these characteristics are not inferior in using temperature range and a hot spot temperature to be acting. 8.4 using and handling (1) it is neces sary to investigate the performance and reliability enough when using under harsh environment. especially, the performance of the product is occasionally damaged when using with the dewy state or ion material adhered. (2) it is necessary to protect the edge a nd protection coat of resistors from mechanical stress. (3) handle with care when pc board is divided or fixed on support body, because bending of pc board after chip mounting will make mechanical stress for resistors.
rr00 - 1098 specification for chip resistor rr0816 series susumu co.,ltd title: spec.no: 0 rev. no. 16 / 16 (4) resistors shall be used within rated ran ge shown in specification. especially, if voltage more than specified value will be loaded to resistor, there is a case it will make damage for machine because of temperature rise depending on generation of heat, and increase resistance value or breaks. (5) in case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a resistor and to reduce a load power according to load reduction curve, because a temperature rise of a resistor depends on influence of heat from mounting density a nd neighboring element. (6) observe limiting element voltage and maximum overload voltage specified in each specification. (7) if there is a possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it is necessary that operating conditio n shall be set up before use, because performance of thin film resistor is affected by a large shock voltage. 8.5 using and handling refer to eiaj rcr - 2121 -- electronic industries association of japan technological report "fixed resistor directions guide line.?

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